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4. All-glass chips bonded at low temperatures: what applications?
All-glass chips, sealed by low-temperature bonding, combine the advantages of all-glass chips, namely :
ability to perform recurring analyses ;
easy cleaning of fluid channels ;
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superiority of glass for certain applications mentioned above,
and the advantages of low-temperature bonding, notably that it does not damage any materials or nanostructures present in the chip that would be thermodegradable at temperatures above 300°C.
As already mentioned, a marketable lab-on-a-chip must include all stages of analysis: injection, extraction, separation and detection. Low-temperature sealing makes it possible to integrate thermodegradable structures or materials that can bring improvements to each stage of analysis. Among...
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All-glass chips bonded at low temperatures: what applications?
Conclusion
Bibliography
Websites
Klearia http://www.klearia.com
Micralyne https://www.teledyne.com/en-us
Micronit http://www.micronit.com
Event
MicroTAS Congress
Directory
Industrial players: Klearia, Micronit, Micralyne, Micrux, Chip Shop, Dolomite
Research laboratories: LPN, LAAS, ESPCI, Institut Curie
Publications (magazines, books, etc.) : Lab on a Chip (see website)
Patents
Anodic bonding. US patent 3, 397.278 1968
Process for manufacturing a microfluidic chip. Associated chip and plate. Patent FR 1054183 CNRS May 28, 2010.
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