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3. Optical packaging technologies
Since the early 1990s, packaging has become a subject of study in its own right, requiring its consideration right from the design phase. Indeed, the evolution of electronic circuits requires packaging to cope with, and participate in, the increasing density of electrical interconnections, signal frequencies and heat densities to be dissipated.
Optoelectronics adds new constraints, such as thermal management that can be regulated down to 1/10th of a degree to ensure spectral adjustment, and above all optical coupling with a guide or fiber, generally single-mode, requiring alignment of submicron precision and stability.
In this way, optoelectronics introduces criticality into the component assembly phase, with a higher level of requirement for electronic components.
This section describes optical packaging technologies,...
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Optical packaging technologies
Conclusion
Bibliography
- (1) - KLOTZIN (D.) et al - High-speed directly modulated fabry. - IEEE J. of Lightwave Tech., vol. 21, n° 1 (2003).
- (2) - ZANVOORT (V.) et al - Proc. IEEE/LEOS, Benelux (2003).
General works
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Standards and norms
- ED.2.0, 2002 Information technology – Generic wiring of user premises - ISO/IEC 11801 - 2002
- Fibre optic active components and devices – Package and interface standards - IEC 62148-x -
- Caractéristiques des câbles et fibres optiques monomodes - ITU-T G.652 - 06-05
- Caractéristiques d'un câble à fibres optiques multimodes à gradient d'indice (50/125 mm) - ITU-T G.651 - 02-98
- Issue 2 : Generic...
Directory
Organizations
Optics & Microwaves Club http://www.france-optique.org/indexfram.html
CREDO, Cercle de réflexion et d'étude pour le développement de l'optique (Circle of reflection and study for the development of optics) http://www.cercle-credo.com/
...Websites
Materials requirements for optoelectronic packaging fiber soldering http://www.sjsu.edu/faculty/selvaduray/page/papers/mate234/fahongjin.pdf
Matweb: materials database http://www.matweb.com
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