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6. Future developments
6.1 New applications
The development of semiconductor materials with large band gaps, foremost among which is silicon carbide (SiC), opens the way to power components operating at higher temperatures (over 500°C, see figure 1 ), and at high voltages (several tens of kilovolts)
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Future developments
Bibliography
- (1) - Indium Corp - Alloys sorted by temperature. - Liste d'alliages de brasure http://www.indium.com/products/alloy_sorted_by_temperature.pdf
- (2) - DUPONT (L.) -...
Digital tools
In addition to power electronics "circuit" simulation tools such as Saber (editor: Synopsys), the design of power modules requires mechanical-thermal calculation resources. These include Ansys (Ansoft) and Comsol Multiphysics (Comsol), both based on the finite element method.
To optimize electrical performance, it is useful to be able to calculate the parasitic elements of the circuit, particularly...
Events
At European level, there are two main power electronics conferences, which include sessions on packaging: EPE (European Power Electronics) and PCIM (ower Conversion Intelligent Motion). The former is more research-oriented, while the latter is aimed more at industry, even if the boundary is sometimes blurred in a field as applied as power electronics.
Packaging is also discussed at power electronics conferences...
Regulations
European RoHS Directive (Restriction of the Use of Certain Hazardous Substances) Directive 2002/95 bans hazardous substances in electronic systems http://www.rohs.gov.uk
Directory
Manufacturers – Suppliers – Distributors (non-exhaustive list)
Power modules: ABB, Dynex, Eupec, International Rectifier, IXYS, Microsemi, Mitsubishi, Semelab, Semikron
Discrete power components: Fairchild Semiconductor, Fuji Semiconductor, Infineon, International Rectifier, Microsemi, NXP, ON Semiconductor, ST Microelectronics, Toshiba, Vishay
The list of power module...
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