Français
1. Packaging
The aim of this section is not to cover microprocessor packaging in detail, but simply to illustrate the various techniques used. Readers wishing to go into this aspect in greater depth should consult the articles and reference works
The Ultimate Scientific and Technical Reference
A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects
This article is included in
Electronics
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Ongoing reading
Packaging
Packaging
Development methods and tools
Bibliography
The Ultimate Scientific and Technical Reference
A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects
