Article | REF: E3560 V3

Microprocessors -Implementation and examples of application

Author: Dominique HOUZET

Publication date: November 10, 2013, Review date: December 7, 2017

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1. Packaging

The aim of this section is not to cover microprocessor packaging in detail, but simply to illustrate the various techniques used. Readers wishing to go into this aspect in greater depth should consult the articles and reference works

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