7. Noise sources in integrated circuits

This chapter, which repeats and updates the information published in [E2475] , includes a description of the evolution of component manufacturing technologies with regard to EMC aspects, and a description of the main magnetic coupling mechanisms, highlighting the important role of the housing.

7.1 Technology evolution

The frantic race for integrated circuit performance is reflected in colossal technological efforts to double the performance of integrated circuits every three years, targeting microprocessors and memories in particular, for applications such as communicating objects. Since the 1970s, constant progress in lithographic processes has enabled a reduction in the dimensions...

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Noise sources in integrated circuits

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Main interactions of particles with matter

Bibliography

(1) - KRON - Tensorial Analysis of Networks - (1939).
(2) - MAURICE (O.) - La compatibilité électromagnétique des systèmes complexes. - Hermès-Lavoisier (2007).
(3)...

Websites

Ibis Specifications of the different IBIS standards on http://www.eda.org/ibis/home/specs/specs.htm (page consulted on 10/28/10)

IEC specifications for various standards modeling components (IEC 62433 project), emission measurement methods (IEC 61967) and immunity (IEC 62132) on

Standards and norms

International Electrotechnical Commission IEC http://www.iec.ch/

EMC IC modelling – Part 1: General modelling framework IEC 62 433-1 47A/840/DTS. - IEC 62433 - (2010)
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 1: General conditions and definitions IEC 61967-1 - IEC 61967-1 - (2002-03)