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Research and innovation | REF: RE255 V1

ALD in Microelectronic. Applications, Equipments and Productivity

Authors: Mickael GROS-JEAN, Arnaud MANTOUX

Publication date: November 10, 2016

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6. Interconnections and contact

Towards the end of the 1990s, aluminum was replaced by copper for the manufacture of metal interconnects, as the latter has a lower resistivity, allowing the electrical signal to propagate more rapidly through the circuit . Interconnections are formed by copper lines on different levels (up to 12), each level being connected by copper studs (figures 5 b and

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