4. Conclusions and outlook
4.1 Components and applications
Changes in the conditions under which power converters are used (ever higher power densities and increasingly severe operating environments) have encouraged the development of wide bandgap semiconductor components in general, and the SiC sector in particular. The ability of these devices to operate at high temperatures enables them to increase power density while reducing the cooling effort required, with considerable savings in terms of mass and cost. To exploit the full potential of SiC power components, it is necessary to develop specific packages, component control logic and passive components such as capacitors and inductors. The physical properties of SiC compared with those of silicon suggest that power components will have a significant impact...
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Conversion of electrical energy
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References
Manufacturers – Suppliers (non-exhaustive list)
CREE http://www.cree.com
Criepi http://criepi.denken.or.jp/en/
Dynex http://www.dynexsemi.com
GE...
Organizations
WTC consulting http://www.wtc-consult.de
Events
International SiC conferences: alternate every 2 years between an international conference (ICSCRM) and a European conference (ECSCRM).
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