Overview
FrançaisABSTRACT
Power packages are essential components of semi-conductors. They dissipate heat and ensure the electrical connections of the chip. This article starts by presenting the characteristics of a power packages. According to variables related to heat, electricity and reliability, the performances of the various packaging solutions can be compared. The available packages are then presented. They are classified in two families: single-chip packages and modules (several chips providing one or several elementary functions). In the third part of this article, the content of the package is detailed via an analysis of each of its elementary component and an overview of the problems encountered when designing the packaging of a component is notably provided. To conclude, the materials, processes used and the reasons for their selection are presented together with the solutions which are being studied in order to improve existing ones.
Read this article from a comprehensive knowledge base, updated and supplemented with articles reviewed by scientific committees.
Read the articleAUTHOR
-
Cyril BUTTAY: Doctorate in electrical engineering, INSA Lyon engineer - CNRS research fellow
INTRODUCTION
Semiconductor power components first appeared over 50 years ago. During this period, their technology has advanced extraordinarily, reaching levels that in some cases approach the theoretical limits of the material: power densities handled can be well in excess of a hundred watts per square centimetre, and a chip scarcely more than a centimetre square can withstand voltages of several kilovolts or currents of over a hundred amperes.
This being the case, it's clear that the power chip's immediate environment (its casing, or in a more generic sense, its packaging) plays a vital role in its operation. This is where the chip's electrical connections and heat dissipation take place. With the excellent performance of today's power semiconductors, it's common for the package to be the main limiting factor for the component as a whole.
At first glance, this may seem surprising: why has a totally passive element like the casing, which calls on technologies that are a priori less advanced than microelectronics, not made as much progress as chips? The answer lies in the multiplicity of packaging functions. Here, perhaps more than anywhere else, the task of design is to find a compromise between often contradictory imperatives: while it's relatively easy to design a thermally or electrically efficient package, or to find a low-cost solution, achieving all three objectives at the same time is like squaring a circle!
To fulfill its various roles, a housing must call on a multitude of different elements, materials and techniques. This is what we present to you in this dossier.
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference
CAN BE ALSO FOUND IN:
This article is included in
Conversion of electrical energy
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Power modules and enclosures (packaging)
Bibliography
- (1) - Indium Corp - Alloys sorted by temperature. - Liste d'alliages de brasure http://www.indium.com/products/alloy_sorted_by_temperature.pdf
- (2) - DUPONT (L.) -...
Digital tools
In addition to power electronics "circuit" simulation tools such as Saber (editor: Synopsys), the design of power modules requires mechanical-thermal calculation resources. These include Ansys (Ansoft) and Comsol Multiphysics (Comsol), both based on the finite element method.
To optimize electrical performance, it is useful to be able to calculate the parasitic elements of the circuit, particularly...
Events
At European level, there are two main power electronics conferences, which include sessions on packaging: EPE (European Power Electronics) and PCIM (ower Conversion Intelligent Motion). The former is more research-oriented, while the latter is aimed more at industry, even if the boundary is sometimes blurred in a field as applied as power electronics.
Packaging is also discussed at power electronics conferences...
Regulations
European RoHS Directive (Restriction of the Use of Certain Hazardous Substances) Directive 2002/95 bans hazardous substances in electronic systems http://www.rohs.gov.uk
Directory
Manufacturers – Suppliers – Distributors (non-exhaustive list)
Power modules: ABB, Dynex, Eupec, International Rectifier, IXYS, Microsemi, Mitsubishi, Semelab, Semikron
Discrete power components: Fairchild Semiconductor, Fuji Semiconductor, Infineon, International Rectifier, Microsemi, NXP, ON Semiconductor, ST Microelectronics, Toshiba, Vishay
The list of power module...
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference