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Article | REF: IN72 V1

INDAR process: disassembly of bonded structural assemblies

Authors: José ALCORTA,, Maxime OLIVE, Eric PAPON

Publication date: October 10, 2007

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AUTHORS

  • José ALCORTA,

  • Maxime OLIVE

  • Eric PAPON

 INTRODUCTION

The INDAR (Innovative Disassembling Adhesives Research) process is a technological solution designed to disassemble structural glued joints on demand. The process provides a simple, effective solution to maintenance and recycling problems, and is fully in line with our eco-design approach.

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