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7. Conclusion
Polymers are often an advantageous alternative to inorganic, mainly ceramic, dielectrics. This is mainly due to their mechanical properties (lightness, flexibility...), chemical stability and ease of processing in a wide variety of forms (thin films, 3D moldings...) and formulations. Their inherent shortcomings are their limited temperature stability and lower permittivity, but the wide variety of formulations they allow (copolymers, composites, etc.) means they can meet very specific specifications. Today, they are irreplaceable for the production of very high-performance components and interconnection systems.
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Bibliography
Websites
Trade magazines and newsletters https://www.plusplasticelectronics.com/
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IEEE Conference on Electrical Insulation and Dielectric Phenomena http://www.ieee.org
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Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates http://www.astm.org/Standards/D3380.htm
Standard Test Methods for Polymeric Films Used for Electrical Insulation
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