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Article | REF: M1622 V1

Composite electroplating - Modeling

Author: Patrice BERÇOT

Publication date: June 10, 2003, Review date: October 25, 2018

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4. Conclusion and comments

The most widely accepted co-deposition mechanism involves, on the one hand, the transport of particles by agitation on the cathode surface and, on the other, incorporation into the metal by reduction of ions adsorbed on the particle surface. The various models developed to predict the amount of particles incorporated in experiments have so far failed. Models involving particle transport and particle/cathode interactions offer a promising prospect.

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