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4. Production of fusible microbeads for soldering
The terminal block must perform 4 functions:
the electrical connection between the component to be assembled and its support;
removal of heat dissipated by the chip;
environmental protection ;
structural bonding between chip and substrate.
The material and process selected have a direct impact on system performance. The table at 4 lists the most frequently used ball materials and their main characteristics:
4.1 Fusible alloys
Fusible alloys are at the heart of the problem; several methods are used to deposit the alloy,...
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Production of fusible microbeads for soldering
Choice of manufacturing process
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