Article | REF: AM3576 V1

Plastic packaging - Transformation processes

Author: Pierre CHOMON

Publication date: July 10, 2008

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2. Biorientation without heat-setting: shrink films

A limited number of processors worldwide hold this technology, and multiple patents cover the processes, especially when there is an improved O 2 barrier and the simultaneous use of irradiation (β or γ).

Note: irradiation enhances thermal resistance and puncture resistance by creating three-dimensional bonds.

2.1 With O2 barrier: presence of PVDC, EVOH and/or PA

Double-bubble technology is used (see figure 3 ); when irradiation is used, the process is as shown in figure...

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Biorientation without heat-setting: shrink films