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2. Biorientation without heat-setting: shrink films
A limited number of processors worldwide hold this technology, and multiple patents cover the processes, especially when there is an improved O 2 barrier and the simultaneous use of irradiation (β or γ).
Note: irradiation enhances thermal resistance and puncture resistance by creating three-dimensional bonds.
2.1 With O2 barrier: presence of PVDC, EVOH and/or PA
Double-bubble technology is used (see figure 3 ); when irradiation is used, the process is as shown in figure...
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Biorientation without heat-setting: shrink films
Coextruded films
Bibliography
- - Emballages Magazine http://www.emballagesmagazine.com/
Manufacturers
Table
1
gives the references of the companies cited in the article
Organization
Union Nationale des Industries de Transformation des Emballages Souples (UNITES) http://www.unites-fr.org/
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